Advanced Packaging Market is used in 5G chipsets to offer low power consumption, high performance and better dimensions. Rising inclination towards 5G technology and a need to expand fab operations is likely to propel industry growth. The market may exceed USD 40 billion by 2026.

A momentous rise in demand for AI and IoT devices has fueled the demand for compact chipsets and solutions. As a result, firms operating in the market are striving towards new product development.

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Based on packaging type, the market is divided into flip-chip, fan-out, fan-in Wafer Level Packaging (WLP), 2.5D/3D and embedded-die. Estimates suggest that the 2.5D/3D advanced packaging technology segment may grow by 20% over the projected period given to increasing usage of the technology in processors, memory devices and graphical processing units.

In terms of application, the advanced packaging business is divided into aerospace & defense, industrial, consumer electronics, healthcare and automotive. Out of them, the industrial sector is projected to gain a market share of over 5% during the forecast timeframe. This growth can be attributed to proliferating demand for automated machinery and industrial robots in several industries for production, pick & place and related tasks.

This technologies enhances the functionality of memory and processors as well as shrink their size by 30%-40%. Companies have been integrating these packaging technologies into their foundries in order to reduce bulk production cost and improve volume. However, only a few are firms are incorporating 2.5D/3D packaging technologies due to its high installation cost.

Geographically, Europe advanced packaging market is likely to register 5% CAGR on account of increasing government initiatives regarding the development of the semiconductor industry. European chip makers are focusing on adopting various strategic initiatives such as mergers with manufacturers and collaborations to improve fabrication operations, which may further boost regional market growth.

The Prominent Key Players in the advanced packaging market include ASE Group, ChipMOS Technologies Inc., Sanmina Corporation, Siliconware Precision Industries Co., Ltd

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Table of Content

5.1. Advanced Packaging Market Key trends, by packaging type

5.2. Flip-Chip

5.2.1. Market estimates and forecast, 2016 - 2026

5.3. Fan-in WLP

5.3.1. Market estimates and forecast, 2016 - 2026

5.4. Embedded - die

5.4.1. Market estimates and forecast, 2016 - 2026

5.5. Fan-out

5.5.1. Market estimates and forecast, 2016 - 2026

5.6. 2.5D/3D

5.6.1. Market estimates and forecast, 2016 - 2026

Chapter 6. Advanced Packaging Market, By Application

6.1. Key trends, by application

6.2. Consumer electronics

6.2.1. Market estimates and forecast, 2016 - 2026

6.3. Automotive

6.3.1. Market estimates and forecast, 2016 - 2026

6.4. Industrial

6.4.1. Market estimates and forecast, 2016 - 2026

6.5. Healthcare

6.5.1. Market estimates and forecast, 2016 - 2026

6.6. Aerospace & defense

6.6.1. Market estimates and forecast, 2016 - 2026

6.7. Others

6.7.1. Advanced Packaging Market estimates and forecast, 2016 – 2026

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